AI NewsWaveSiemens and TSMC Expand Use of Agentic AI in Semiconductor Design
Key points
- Siemens EDA and TSMC strengthen AI design cooperation
- AI agents to automate DRC error fixes
- Aim to improve design productivity through tape-out
The EDA division of Siemens Digital Industries Software said on the 7th that it is strengthening cooperation with TSMC on agentic AI-based semiconductor design automation. Building on the TSMC Open Innovation Platform (OIP) ecosystem, the two companies will raise productivity across the design workflow.
Hellot reported that AI agents automate the correction of design rule check (DRC) errors, shortening the time to tape-out. Techworld News explained that AI and agentic workflows will be applied from DRC error correction to placement and routing, 3D IC and silicon photonics design.
Digital Daily added that, alongside advancing packaging technologies such as 3DFabric and CoWoS-L, the company obtained certification for the A14, A16, 2-nanometer and 3-nanometer processes.