AI NewsWaveOtec Carrier and B-Lab Team Up on AI Data Center Cooling Solutions
Key points
- Otec Carrier and B-Lab sign MOU on cooling solution supply
- Agreement signed on site at HARFKO 2026
- Cooling equipment to be supplied for AI data center business
Otec Carrier signed a memorandum of understanding (MOU) on cooperation in supplying cooling solutions for AI data centers (AIDC) with B-Lab, an AI and AX SI specialist. Datanet and EBN reported that the agreement was made on site at HARFKO 2026 at KINTEX, and EBN wrote that Otec Carrier announced it on the 23rd.
EBN explained that Otec Carrier will supply equipment such as chillers and air handlers for the AI data center business B-Lab is pursuing. Datanet introduced Otec Carrier (Chairman Kang Sung-hee) and B-Lab (CEO Hwang Sung-hyun) as the parties to the agreement.