AI NewsWaveHenkel to Show Packaging Materials for AI and HBM at SEDEX 2026 Semiconductor Exhibition
Key points
- Henkel to take part in the show from the 14th to the 16th
- Unveils advanced packaging materials for AI and HBM
- Stresses materials that control heat and warpage
The Adhesive Technologies division of Germany's Henkel said on the 6th that it will take part in SEDEX 2026 (the 28th Semiconductor Exhibition), held at COEX in Seoul from the 14th to the 16th.
Under the theme 'Advanced Packaging for AI,' Henkel plans to show advanced packaging material technology for artificial intelligence, high-bandwidth memory (HBM) and high-performance computing (HPC).
One outlet explained that as highly integrated technologies such as 2.5D and 3D packaging, which connect chips vertically and horizontally, and chiplets spread, materials that handle heat and mechanical stress are becoming more important.