AI NewsWaveHanmi Semiconductor Receives Plaque of Appreciation from SK hynix for HBM Mass Production Contribution
Key points
- Hanmi Semiconductor receives plaque from SK hynix
- Recognized for HBM equipment development and mass production support
- Cooperation began in 2015 with TC bonder development
Hanmi Semiconductor said on the 30th that it received a plaque of appreciation from SK hynix for its contribution to developing high bandwidth memory (HBM) production equipment and supporting stable mass production.
According to Chosun Biz, the two companies began working together in 2015 on the development of a thermal compression (TC) bonder for HBM production. Bloter reported that the partnership has continued through to production of the next-generation HBM4, and EBN reported that Hanmi Semiconductor plans to strengthen its competitiveness in next-generation HBM equipment based on more than 10 years of technical cooperation.
On the same day, Hanmi Semiconductor also released third-quarter results. According to Digital Daily, revenue was 181.0 billion won, up 8.9% from a year earlier, and operating profit was 90.8 billion won, up 33.9%, putting the operating margin above 50%. IT Chosun reported that the company expects record quarterly revenue in the fourth quarter on deferred equipment sales and expanded overseas supply. Bloter reported that the company may set a record high in annual revenue for a third straight year this year, and that it will target demand for North American mega-fab expansion with Hanmi USA, newly established in the United States.
Chosun Biz and Digital Daily reported that Kim Byung-seok, a Hanmi Semiconductor senior vice president, received the Silver Tower Order of Industrial Service Merit on the 29th. According to Chosun Biz, Kim worked at the company for 35 years and led the development of the TC bonder equipment for HBM production, and was recognized for contributing to the company's No. 1 global market share in TC bonders for HBM.
Glossary HBM is high bandwidth memory, which stacks DRAM vertically to increase data transfer speed. A TC bonder refers to thermal compression equipment that attaches semiconductor chips using heat and pressure.